May 15, 2024 14:30 JST

Source: Honda Motor Co, Ltd

Honda and IBM sign Memorandum of Understanding to Explore Long-term Joint Research and Development of Semiconductor Chip and Software Technologies for Future Software-Defined Vehicles
Agreement outlines intent to research and develop solutions to new challenges related to processing performance, power consumption, and design complexity

TOKYO, Japan / ARMONK, N.Y., U.S.A., May 15, 2024 - (JCN Newswire) - Honda Motor Co., Ltd. (Honda) today announced that Honda and IBM have signed a Memorandum of Understanding (MOU) outlining their intent to collaborate on the long-term joint research and development of next-generation computing technologies(1) needed to overcome challenges related to processing capability, power consumption, and design complexity for the realization of the software-defined vehicles (SDV) of the future.

The application of intelligence/AI technologies is expected to accelerate widely in 2030 and beyond, creating new opportunities for the development of SDVs. Honda and IBM anticipate that SDVs will dramatically increase the design complexity, processing performance, and corresponding power consumption of semiconductors compared to conventional mobility products. In order to solve anticipated challenges and realize highly-competitive SDVs, it is critical to develop capabilities in the independent research and development of next-generation computing technologies. Based on this understanding, the two companies began considering long-term joint research and development opportunities.

In particular, the MOU outlines areas of potential joint research of specialized semiconductor technologies such as brain-inspired computing(2) and chiplet technologies, with the aim to dramatically improve processing performance while, simultaneously, decreasing power consumption. Hardware and software co-optimization is important to ensure high performance and fast time to market. To achieve such benefits and manage design complexity for future SDVs, the two companies also plan to explore open and flexible software solutions. 

Through this collaboration, the two companies would strive to realize SDVs that feature the world’s top-level computing and power saving performance.

(1) Computing technology being developed with an aim to achieve both high processing performance and low power consumption in the 2030s and beyond.
(2) Computer architecture and algorithms that mimic the brain's structure and function while optimizing for silicon.

Source: Honda Motor Co, Ltd
Sectors: Electronics, Automotive, EVs, Transportation

Copyright ©2024 JCN Newswire. All rights reserved. A division of Japan Corporate News Network.

Related Press Release


Honda Issues "Honda ESG Data Book 2024"
June 27 2024 12:17 JST
 
Honda and MC to Establish New Company, ALTNA Co., Ltd.
June 13 2024 16:18 JST
 
Honda to Begin Sales of New N-VAN e: Commercial-use Mini-EV in Japan
June 13 2024 15:04 JST
 
Yuki Tsunoda to Continue Competing in F1 for the 2025 Season with VISA Cash App RB Formula One Team
June 10 2024 11:37 JST
 
Honda Advances Hydrogen Strategy with Production Launch of Fuel Cell Electric Vehicle in Ohio
June 07 2024 17:29 JST
 
Team HRC Participation in the Suzuka 8 Hours Endurance Road Race 45th Tournament
May 31 2024 13:59 JST
 
Honda Opens New R&D Facility in Bengaluru to Accelerate Electrification in India
May 09 2024 13:13 JST
 
POSCO Future M and Honda Reach Basic Agreement on Collaboration for Production of Cathode Materials for Automotive Batteries in Canada
April 29 2024 13:25 JST
 
Honda Plans to Establish Comprehensive Electric Vehicle Value Chain in Ontario, Canada
April 29 2024 13:16 JST
 
GAC Honda to Begin Sales of All-new e:NP2, the Second Model of e:N Series
April 25 2024 15:50 JST
 
More Press release >>

Latest Press Release


More Latest Release >>